The introduction of strain in semiconductors is a well-known technique for increasing their conductivity and thus for enhancing the performance of silicon-based electronic devices. In the present work, we investigate the strain induced in the Si substrate by linear SiGe/Si structures with a width less than 100 nm. By varying the Ge content and geometrical parameters, it is possible to maximize the strain in the Si substrate without detrimental plastic relaxation in the SiGe stripes. The structures were defined by electron-beam lithography from strained SiGe deposited epitaxially by low-energy plasma-enhanced chemical vapor deposition. The strain in the heterostructures has been characterized by a combination of finite-element modeling, x-ray diffraction, and μRaman spectroscopy techniques. We show that nano-patterning induces an anisotropic strain relaxation in the SiGe stripe with a simultaneous strong compression of the Si substrate.

Bollani, M., Chrastina, D., Fiocco, M., Mondiali, V., Frigerio, J., Gagliano, L., et al. (2012). Lithographically defined low dimensional SiGe nanostripes as silicon stressors. JOURNAL OF APPLIED PHYSICS, 112(9), 094318-094321 [10.1063/1.4765009].

Lithographically defined low dimensional SiGe nanostripes as silicon stressors

BONERA, EMILIANO
2012

Abstract

The introduction of strain in semiconductors is a well-known technique for increasing their conductivity and thus for enhancing the performance of silicon-based electronic devices. In the present work, we investigate the strain induced in the Si substrate by linear SiGe/Si structures with a width less than 100 nm. By varying the Ge content and geometrical parameters, it is possible to maximize the strain in the Si substrate without detrimental plastic relaxation in the SiGe stripes. The structures were defined by electron-beam lithography from strained SiGe deposited epitaxially by low-energy plasma-enhanced chemical vapor deposition. The strain in the heterostructures has been characterized by a combination of finite-element modeling, x-ray diffraction, and μRaman spectroscopy techniques. We show that nano-patterning induces an anisotropic strain relaxation in the SiGe stripe with a simultaneous strong compression of the Si substrate.
Articolo in rivista - Articolo scientifico
SiGe, stress, nanotechnology, Raman, lithography
English
2012
112
9
094318
094321
none
Bollani, M., Chrastina, D., Fiocco, M., Mondiali, V., Frigerio, J., Gagliano, L., et al. (2012). Lithographically defined low dimensional SiGe nanostripes as silicon stressors. JOURNAL OF APPLIED PHYSICS, 112(9), 094318-094321 [10.1063/1.4765009].
File in questo prodotto:
Non ci sono file associati a questo prodotto.

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/10281/41908
Citazioni
  • Scopus 9
  • ???jsp.display-item.citation.isi??? 9
Social impact