Novel approaches to the realization of the metal-organic semiconductor electrical contact

The realization of the metal/semiconductor junction is a critical step in the fabrication of (opto-)electronic devices. This step is even more demanding in the case of organic semiconductors, being particularly vulnerable to traditional metallization processes. Here, we describe two novel methods for the soft-metallization of the surface of organic semiconductors. One is based on the liquid-assisted deposition of metal foils of submicrometric thickness. The other one is based on an electroless process giving rise to a nanostructured metal deposit with controlled thickness and morphology. These methods are validated by the electrical characterization of simple two-terminal devices with organic active layers embedded.