In this paper, the correlation between dislocation density and transistor leakage current is demonstrated. The stress evolution and the generation of defects are studied as a function of the process step, and experimental evidence is given of the role of structure geometry in determining the stress level and hence defect formation. Finally, the role of high-dose implantations and the related silicon amorphization and recrystallization is investigated.

Mica, I., Polignano, M., Carnevale, G., Ghezzi, P., Brambilla, M., Cazzaniga, F., et al. (2002). Crystal defects and junction properties in the evolution of device fabrication technology. JOURNAL OF PHYSICS. CONDENSED MATTER, 14(48), 13403-13410 [10.1088/0953-8984/14/48/395].

Crystal defects and junction properties in the evolution of device fabrication technology

BONERA, EMILIANO
2002

Abstract

In this paper, the correlation between dislocation density and transistor leakage current is demonstrated. The stress evolution and the generation of defects are studied as a function of the process step, and experimental evidence is given of the role of structure geometry in determining the stress level and hence defect formation. Finally, the role of high-dose implantations and the related silicon amorphization and recrystallization is investigated.
Articolo in rivista - Articolo scientifico
Crystal defects; junction properties; ULSI
English
2002
14
48
13403
13410
none
Mica, I., Polignano, M., Carnevale, G., Ghezzi, P., Brambilla, M., Cazzaniga, F., et al. (2002). Crystal defects and junction properties in the evolution of device fabrication technology. JOURNAL OF PHYSICS. CONDENSED MATTER, 14(48), 13403-13410 [10.1088/0953-8984/14/48/395].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/10281/23514
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