This paper presents the design and development of a silicon-based three-axial force sensor to be used in a flexible smart interface for biomechanical measurements. Normal and shear forces are detected by combining responses from four piezoresistors obtained by ion implantation in a high aspect-ratio cross-shape flexible element equipped with a 525 μm high silicon mesa. The mesa is obtained by a subtractive dry etching process of the whole handle layer of an SOI wafer. Piezoresistor size ranges between 6 and 10 μm in width, and between 30 and 50 μm in length. The sensor configuration follows a hybrid integration approach for interconnection and for future electronic circuitry system integration. The sensor ability to measure both normal and shear forces with high linearity (≅99%) and low hysteresis is demonstrated by means of tests performed by applying forces from 0 to 2 N. In this paper the packaging design is also presented and materials for flexible sensor array preliminary assembly are described.
Beccai, L., Roccella, S., Arena, A., Valvo, F., Valdastri, P., Menciassi, A., et al. (2005). Design and fabrication of a hybrid silicon three-axial force sensor for biomechanical applications. SENSORS AND ACTUATORS. A, PHYSICAL, 120(2), 370-382 [10.1016/j.sna.2005.01.007].
Design and fabrication of a hybrid silicon three-axial force sensor for biomechanical applications
Carrozza M. C.;
2005
Abstract
This paper presents the design and development of a silicon-based three-axial force sensor to be used in a flexible smart interface for biomechanical measurements. Normal and shear forces are detected by combining responses from four piezoresistors obtained by ion implantation in a high aspect-ratio cross-shape flexible element equipped with a 525 μm high silicon mesa. The mesa is obtained by a subtractive dry etching process of the whole handle layer of an SOI wafer. Piezoresistor size ranges between 6 and 10 μm in width, and between 30 and 50 μm in length. The sensor configuration follows a hybrid integration approach for interconnection and for future electronic circuitry system integration. The sensor ability to measure both normal and shear forces with high linearity (≅99%) and low hysteresis is demonstrated by means of tests performed by applying forces from 0 to 2 N. In this paper the packaging design is also presented and materials for flexible sensor array preliminary assembly are described.| File | Dimensione | Formato | |
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