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Narducci, D., Cuomo, J., Pappas, D., Sachdev, K. (1992). Nondestructive evaluation of adhesion at metal-insulator interfaces based on extremely-low-frequency dielectric-spectroscopy. In Metallized Plastics 3: Fundamental and Applied Aspects (pp.365-383). New York, NY : Plenum Press Div Plenum Publishing Corp.

Nondestructive evaluation of adhesion at metal-insulator interfaces based on extremely-low-frequency dielectric-spectroscopy

NARDUCCI, DARIO;
1992
paper
Non destructive tests; impedance spectroscopy; adhesion
English
3rd Symp on Metallized Plastics
1992
Metallized Plastics 3: Fundamental and Applied Aspects
0-306-44341-4
1992
365
383
none
Narducci, D., Cuomo, J., Pappas, D., Sachdev, K. (1992). Nondestructive evaluation of adhesion at metal-insulator interfaces based on extremely-low-frequency dielectric-spectroscopy. In Metallized Plastics 3: Fundamental and Applied Aspects (pp.365-383). New York, NY : Plenum Press Div Plenum Publishing Corp.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/10281/47026
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