The thermal plasma etching (TPE) at atmospheric pressure on silica rods was studied. The plasma to rod heat transfer was simulated using a commercial computational fluid dynamics (CFD) code Fluent©. An enthalpy probe has been employed to monitor the plasma conditions before the thermal plasma etching process. The heat transfer between the fluid and the silica walls accounts for the energy loss due to surface radiation and vaporization.

Benocci, R., Esena, P., Galassi, A., Piselli, M., Sciascia, M. (2004). Study of the thermal plasma etching at atmospheric pressure on silica rods. JOURNAL OF PHYSICS D. APPLIED PHYSICS, 37(8), 1206-1213 [10.1088/0022-3727/37/8/008].

Study of the thermal plasma etching at atmospheric pressure on silica rods

Benocci R.
Primo
;
Esena P.
Secondo
;
Galassi A.;Piselli M.;
2004

Abstract

The thermal plasma etching (TPE) at atmospheric pressure on silica rods was studied. The plasma to rod heat transfer was simulated using a commercial computational fluid dynamics (CFD) code Fluent©. An enthalpy probe has been employed to monitor the plasma conditions before the thermal plasma etching process. The heat transfer between the fluid and the silica walls accounts for the energy loss due to surface radiation and vaporization.
Articolo in rivista - Articolo scientifico
plasma torch, etching, silica
English
1206
1213
8
Benocci, R., Esena, P., Galassi, A., Piselli, M., Sciascia, M. (2004). Study of the thermal plasma etching at atmospheric pressure on silica rods. JOURNAL OF PHYSICS D. APPLIED PHYSICS, 37(8), 1206-1213 [10.1088/0022-3727/37/8/008].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/10281/253029
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