The thermal plasma etching (TPE) at atmospheric pressure on silica rods was studied. The plasma to rod heat transfer was simulated using a commercial computational fluid dynamics (CFD) code Fluent©. An enthalpy probe has been employed to monitor the plasma conditions before the thermal plasma etching process. The heat transfer between the fluid and the silica walls accounts for the energy loss due to surface radiation and vaporization.
Benocci, R., Esena, P., Galassi, A., Piselli, M., & Sciascia, M. (2004). Study of the thermal plasma etching at atmospheric pressure on silica rods. JOURNAL OF PHYSICS D. APPLIED PHYSICS, 37(8), 1206-1213 [10.1088/0022-3727/37/8/008].
Citazione: | Benocci, R., Esena, P., Galassi, A., Piselli, M., & Sciascia, M. (2004). Study of the thermal plasma etching at atmospheric pressure on silica rods. JOURNAL OF PHYSICS D. APPLIED PHYSICS, 37(8), 1206-1213 [10.1088/0022-3727/37/8/008]. | |
Tipo: | Articolo in rivista - Articolo scientifico | |
Carattere della pubblicazione: | Scientifica | |
Presenza di un coautore afferente ad Istituzioni straniere: | No | |
Titolo: | Study of the thermal plasma etching at atmospheric pressure on silica rods | |
Autori: | Benocci, R; Esena, P; Galassi, A; Piselli, M; Sciascia, M | |
Autori: | BENOCCI, ROBERTO (Primo) ESENA, PAOLA (Secondo) | |
Data di pubblicazione: | 2004 | |
Lingua: | English | |
Rivista: | JOURNAL OF PHYSICS D. APPLIED PHYSICS | |
Digital Object Identifier (DOI): | http://dx.doi.org/10.1088/0022-3727/37/8/008 | |
Appare nelle tipologie: | 01 - Articolo su rivista |
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