Corrigendum to “Copper electrodeposition onto zinc for the synthesis of kesterite Cu2ZnSnS4 from a Mo/Zn/Cu/Sn precursor stack” (Electrochemistry Communications (2019) 109, (S1388248119302437), (10.1016/j.elecom.2019.106580))

The authors regret to inform that in the caption of Fig. 2 it is mistakenly indicated DEA when instead the image shows the effect of dimethylamine borane complex on copper film morphology. Although the text makes clear that the error is in the caption, we believe it may be confusing. The authors would like to apologize for any inconvenience caused. Corrected caption (Fig. 2): “SEM [scale bar: 5 μm], EDS and AFM analysis of copper layer onto zinc (a, c) −2 mA/cm2, 70 °C, dimethylamine borane complex-free solution. (b, d) −2 mA/cm2, 70 °C, dimethylamine borane complex-containing solution. (e) Graphical representation of the Zn/Cu stack.”